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General Capabilities
  • 1 - 42 Layers 
  • 3mil/3mil trace width/ spacing
    Impedance Control 
  • Microvias (HDI) 
    Blind & Buried vias 
    Pad on Vias 
    Sequential lamination 
  • Surface Finishes: HASL, Entek 106(OSP)
    Silver Immersion, Electroless Ni/Au
    Thincore MLBs 

Fast-Turn PCB Prototyping Lead Time

  China Japan
Delivery 1-2L 4 L 6 L 8 L 10 L 1-2L 4 L 6 L 8 L 10 L
Standard(days) 4 5 7 8 10 4 4 5 6 7
Express(days) 3 4 5 6 8 3 3 4 5 6
Super Express(days) 2 3 4 5 6 2 2 3 4 5
Mach(days) 1 2 3 4 5          
Miracle(days)                    

Manufacturing Capabilities

  China Japan
Items   Standard Advanced Standard Advanced
Max. Board  Size(mm)
PCB Size 570 X 470 620X813 460 X 530 Depends on spec
Maximum No. of Layers
  2-30 50 1 to 40  
Board Thickness(mm)
Single Layer 0.2-6.0 0.3-8.0 0.10 - 3.2 0.06
Double Layer 0.6 0.2 0.10-3.2 0.06
4 Layer 0.80 - 1.60 0.40 - 3.00 0.50-3.20 0.40-0.50
6 Layer 1.20-1.60 0.60-3.00 0.80-3.20 0.60-0.70
8 Layer 1.40 - 1.80 1.00 - 3.00 1.00-3.20 0.80-0.90
10 Layer 1.60 - 2.00 1.20 - 3.00 1.20-3.20 1.00-1.10
12 Layers 1.80 - 2.20 1.40 - 3.00 1.40-3.20 1.20-1.30
Trace(mm)
Width 0.10 (4mil) 0.075 (3mil) 0.07(2.76mil) 0.05-0.07
Clearence 0.10 (4mil) 0.075 (3mil) 0.07(2.76mil) Depends on spec
Hole Size(mm)
Min. PTH 0.2 mm 0.15 mm 0.2 0.15
Laser Drill(mm)
    0.1 mm 0.15  
High Oz Copper
  up to 6 oz up to 8 oz up to 4 oz  
Impedance Controlled Bd
  10% + / - 5% 10% 10%
Build Up Capabilities
  Yes Yes Yes  
Aspect Ratio
  13:1 15:1 10 or under 12
IVH, Blind/Buried Vias
  Yes Yes Yes  

Our Facilities includes.....

  • CAD/CAM

  • Film Plotting

  • Inner Layer Image

  • Inner Layer Inspection

  • Oxide

  • Lay-up & Press

  • Drilling

  • Plating

  • Outer Layer Image

  • Etching

  • Outer Layer Inspection

  • Solder Mask

  • Surface Treatment

  • Routing

  • Bare Board Testing

  • Final Outgoing Inspection

  • Packing

 

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2005 - Singapore Kyoden PTE LTD

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