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Back Plane Board
Description

We use extra-width of conveyor wet equipment and gold plating equipment to manufacture back plane ultra multi layer board for information communication equipment

Specification

ITEM Unit Standard Special
Layer Layers 22 42
Base Material   FR-5 (High Tg) BT. Polyimide, G
Thickness mm 5.4 10
Min. Line Width / Space mm 0.21 0.15
Min. Hole Size mm 0.6 0.4
Aspect Ratio   9 15
Surface Treatment   Electroless Gold, HASL, OSP
 

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2005 - Singapore Kyoden PTE LTD

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