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Build-up Board
Description

We have technology for Build-up (Micro via), used in small size product such as cellular phone, PDA, wireless LAN card, lap top computer, etc. We also fabricate mass production with skip via at a high quality.

Specification

ITEM Unit Standard Special
Layer Layers 8 42
Base Material   FR-4, FR-5 RCC
Thickness mm 0.6 (6 Layers) 0.5 (6 Layers)
Min. Line Width / Space mm 0.1 0.075
Min. Hole Size mm 0.12 0.05
Min. Via Hole Size mm 0.4 0.25

Layer Structure


Stack Via

 

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2005 - Singapore Kyoden PTE LTD

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